Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Koheesio is a versatile framework that supports multiple implementations and works seamlessly with various data processing libraries or frameworks. This ensures that Koheesio can handle any data ...

First lady Melania Trump teamed up with second lady Usha Vance to greet military families at Joint Base Andrews and create holiday care packages for service members to mark the start of the Christmas ...

Multiple security vendors are sounding the alarm about a second wave of attacks targeting the npm registry in a manner that's reminiscent of the Shai-Hulud attack. "The campaign introduces a new ...

Abstract: Advanced semiconductor packages have evolved through multilayering and the increased use of dielectric materials, leading to mechanical issues that affect package yield and reliability. This ...

We have been working in the Kubernetes ecosystem for over five years. During this time, we have consistently struggled with package management, configuration, and distribution. We've spent countless ...

WSJ Heard on the Street Writer Asa Fitch explains how Nvidia’s recent earnings report may have helped allay concerns about a bubble in AI and tech stocks – at least, for now. Photo: Kent ...