Abstract: This work reports the first demonstration of 800V irradiation-hardened (IH) GaN device technology on the GaN-on-SiC power integration platform. IH p-GaN HEMT, MIS HEMT and rectifier are ...
A Colorado-based company, Stack Infrastructure, plans to build a new data center in New Albany, Ohio. The new 300,000-square-foot facility will be built next to the company's existing data center.
Abstract: Direct Transfer Bonding (DTB) is a promising technology for die-to-wafer bonding in 3D/heterogeneous integration, addressing limitations of conventional direct/hybrid bonding (DB/HB) methods ...
VS Code ≥ 1.46.0 Node.js ≥ 14.19 (Optional) SAP BTP CLI & cf CLI if you plan to deploy ...
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