Create a beautiful wire-wrapped ring with this easy beginner-friendly DIY jewelry pattern, using simple wrapping techniques ...
Abstract: 3D silicon photonic integration is a key packaging method for optical I/O. In 3D silicon photonic integration, TSVs are integrated into silicon chips. The TSV annealing process can cause ...
Abstract: We demonstrate a 100 Gbps low-chirp push-pull modulator with ultra-high modulation efficiency of 46 pm/V, leveraging both volatile and non-volatile PZT control, outperforming conventional ...