A team of researchers at Penn State have devised a new, streamlined approach to designing metasurfaces, a class of engineered ...

Fictiv combines AI tools with precision welding and assembly to cut prototype-to-production time for complex manufacturing ...

Abstract: Ultrasonic wire bonding is one of the critical challenges for power semiconductor manufacturing process, especially for silicon carbide (SiC) power devices. Packaging-related strain on the ...

Engineers and computer scientists are developing AI-powered robots that look and act human. Boston Dynamics invited 60 ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...