Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

Abstract: The increasing integration of electronic components and the complexity of printed circuit boards (PCBs) necessitate more efficient, accurate, and safe PCB inspection requirements. Using ...

Abstract: This letter proposes an ultra-low-power grid signal analog processor (UGSP) for magnetoelectric sensor systems. It is designed in accordance with the principle of a lock-in amplifier (LIA) ...