By 2030, Vietnam targets completing the establishment of a digital government, forming a smart government powered by big data and artificial intelligence (AI), delivering proactive, predictive, and ...

Prior to today’s global debut, Tencent’s open-sourced Hunyuan 3D Models have earned worldwide acclaim and popularity among developers and creators Tencent’s Hunyuan 3D capabilities launches globally, ...

Imagine printing a nuclear reactor core — or nuclear fuel pellets — in 3D. It may sound far-fetched that 3D printing could create materials robust enough to withstand the extreme environment of a ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established the "3DIC ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...