Why Thermodynamic Computing Could Be the Future of Artificial Intelligence

Explore the innovative X0 prototype chip and Z1 processor, designed to save energy while advancing machine learning capabilities.
Semiconductor Engineering

Co-Simulation Framework for Parallel DNN Execution on Chiplet-Based Systems (UW–Madison, Washington State)

A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems” was published by researchers at University of Wisconsin ...
IEEE

MPDA: A Massively Parallel Learning and Dependency-Aware Scheduling Algorithm for Data Processing Clusters

Abstract: In the era of large-scale machine learning, large-scale clusters are extensively used for data processing jobs. However, the state-of-the-art heuristic-based and Deep Reinforcement Learning ...
IEEE

PROCA: Programmable Probabilistic Processing Unit Architecture with Accept/Reject Prediction & Multicore Pipelining for Causal Inference

Abstract: Causal inference is an important field in data science and cognitive artificial intelligence. It requires the construction of complex probabilistic models to describe the causal ...