As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...

Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...

Abstract: The evolution of the porous microstructure of sintered silver in service can significantly affect the reliability of power modules, but there are few studies that elucidate the specific ...