Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Another company backed by tech magnate (and part-time apocalypticist) Peter Thiel is seeking to disrupt Silicon Valley.

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

TAIPEI (Taiwan News) — The Ministry of Economic Affairs will provide NT$840 million (US$25.8 million) in subsidies to six ...

Apple has bought IC Mask Design, a firm specializing in the layout of chips and processors. Apple is continuously acquiring companies, and most recently appears to have been buying ones concerned with ...

In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking an unprecedented ...