Abstract: As performance gains from 2D scaling and innovation slows, wafer-level hybrid bonding has become a key enabler for 3D scaling and heterogenous integration. Over the last decade, the industry ...
With India’s high import duties pricing out most foreign cars, a lesser-known route lets UAE-based owners legally bring their vehicles into the country without paying steep taxes. Using the Carnet de ...
Abstract: We present an efficient method for joint optimization of topology, materials and lighting from multi-view image observations. Unlike recent multi-view reconstruction approaches, which ...
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