Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: A recently introduced method for optimizing the time delay unit architecture (TDU-A) of 1-D phased antenna array (PAA) is expanded for the first time to the generalized 2-D PAAs. The ...
Arrays for 'slow and wide' interconnections enable power-efficient and compact short reach links Coherent has announced what is claims is a breakthrough in short-reach optical interconnect technology ...
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