Abstract: We report a novel active split structure of low-temperature polysilicon (LTPS) thin film transistor (TFT) on polyimide (PI) substrate showing robust electrical performance under mechanical ...
Abstract: This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on ...
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