Electronics For You

New Transistor Design Tackles Heat In Small Electronics

Researchers develop a 3D transistor stacking process that boosts performance in flexible and wearable electronics without ...
Kalkine Media

Taiwan Semiconductor Expands Influence in Global Technology Markets

Taiwan Semiconductor Manufacturing strengthens global presence with advanced chip production and industry leadership.
Design And Reuse

UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications

Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and ...
IEEE

Design and Evaluation of a Radiation-Hardened FDSOI SRAM With High-Reliable Elements and Power Management Circuits for Space Application

Abstract: Designing a radiation-tolerant SRAM-based system poses a significant challenge for space facilities operating in radiation environments. Accurate evaluation of SEE sensitivity, along with ...
IEEE

3D-Millimeter Wave Integrated Circuit (3D-mmWIC): A Gold-Free 3D-Integration Platform for Scaled RF GaN-on-Si Dielets with Intel 16 Si CMOS

Abstract: This paper presents a gold-free 3D millimeter wave integrated circuit (3D-mmWIC). Highly scaled GaN-on-Si front-end-of-line (FEOL) RF dielets are integrated with Intel 16 Si CMOS using Cu-Cu ...