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The Canon EOS 5 series turns 20: Who remembers these legendary DSLR and mirrorless cameras?
From the groundbreaking 5D to the cutting-edge R5 Mark II, we take a look at the remarkable journey of the EOS 5 series ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
Using high-speed lasers, researchers have created "5D" data storage technology that could allow 500 TB of data to be written to a CD-sized glass disc, according to the Optica society. The technique ...
Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.
LOS ANGELES, May 19, 2020 /PRNewswire-PRWeb/ -- MedTech Breakthrough, an independent market intelligence organization that recognizes the top technology product companies in the global health and ...
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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
Broadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads. The new platform relies on TSMC's CoWoS and ...
Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...
San Jose, Calif.-based Align Technology Inc. has won the FDA’s nod for its Itero Element 5D imaging system. The company said the Itero Element 5D is the first intraoral scanner with near-infrared ...
Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC Technology
MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...
LAS VEGAS--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem ...
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