This video shows EP42HT-2FG food grade epoxy system from Master Bond. EP42HT-2FG is a room temperature setting, two-component heat resistant epoxy system for bonding metals, rubbers, plastics, and ...

This video shows a chemical resistant and high strength EP62-1 epoxy system from Master Bond. This epoxy system can withstand many acids, bases and solvents. It is mostly used as sealant, adhesive or ...

Description: Master Bond EP41S-F is a two-part epoxy for bonding, sealing, coating, and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and ...

Date Announced: 22 Oct 2009 Master Bond’s newly developed EP30LV-1 is a low viscosity, optically clear epoxy for general purpose bonding, coating, sealing and casting. Linear shrinkage after cure is ...

EP29LPSP two-component epoxy adhesive/sealant withstands temperatures down to 4 K and cryogenic shocks such as cooling from room temperature to liquid helium temperatures in 5 to 10 min. It cures with ...

The UV22 nanosilica-reinforced, UV curable epoxy offers a combination of properties not available in conventional epoxy systems. Features of the nano-sized filler (50 nm) include abrasion resistance, ...

HACKENSACK, N.J.—Master Bond Inc. has released a new single component epoxy designed for glob top and chip coating applications. The firm said in a news release that Supreme 3CCM-85 also can be used ...

Master Bond has developed a two component, room temperature curing epoxy for bonding, coating, sealing and casting called EP30LV. This compound is easy to apply and exhibits high physical strength ...

UV22 is easy to use. Despite the relatively high percentage of nanoparticles (>35%) added to the UV22, it still retains high transparency and low viscosity without sedimentation due to the agglomerate ...

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. Forumlated to serve as a damming compound, the thixotropic paste material can also be utilized for bonding and sealing.

Description: Master Bond EP17HT-100 is a single-part epoxy system that is designed to cure in 60-90 minutes at 200°-220°F. Cures can be accelerated at higher temperatures. This low-heat curing ...