AUSTIN, Texas--(BUSINESS WIRE)--The Silicon Integration Initiative Compact Model Coalition is proud to announce the release of the ASM-ESD diode model, a new electrostatic discharge compact modeling ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
Design of power/driver ICs in compliance with latchup qualification requirements involves a conceptually different approach in comparison with digital LV (low voltage) ICs. The LV ICs’ electrostatic ...
As the popularity of portable electronics, “smart devices”, and automotive electronics keeps increasing, so does the need for analog functions to be embedded in ICs. This drives the demand for ...
ESD or electro-static discharge induced field failures for integrated circuits (IC) has always been an challenge. Literature survey indicates that as high as 35% of total chip field failures are ESD ...
Plano, Texas, USA-- Today, Siemens, a leading industrial technology company, announced that Certus Semiconductor (“Certus”) has adopted Solido™ software for custom integrated circuit (IC) design to ...
In the semiconductor manufacturing industry, damage and yield losses attributed to the effects of static charges are well documented along with the determination of many of the specific causes. 1 If ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback