Syntec Optics (Nasdaq: OPTX) CEO to Speak to Global Leaders about Future of Advanced Optics

Syntec's Chairman and CEO delivered the keynote address in 2024 on the future of optics and photonics to global leaders in ...
Optics

ficonTEC introduces industry’s first, ATE agnostic, top-sided electro-optical wafer-level tester

ficonTEC proudly announces the release of a new single-sided electro-optical wafer-level tester, a first-of-its-kind solution fully compatible with the world’s two largest semiconductor ATE (automated ...
Business Wire

OmniVision Unveils World’s First Automotive Wafer-Level Camera Module, Enabling Better Driver Monitoring Systems in More Vehicles

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first ...
Seeking Alpha

FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...
Nasdaq

Aehr Announces Shipment of New High-Power Configured FOX-XP(TM) System for Wafer Level Burn-in and Stabilization of Next Generation Silicon Photonics Integrated Circuits

FREMONT, CA / ACCESSWIRE / March 1, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has shipped the first order from a ...
Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...
KTLA

EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...