Waterbury, CT. MacDermid Enthone Electronics Solutions has announced the release of the Affinity ENIG 2.0 process, a high-reliability, low-variation electroless-nickel immersion-gold plating process.

EK has announced that it plans to improve the nickel-plating process it uses when manufacturing its waterblocks. We previously reported that the waterblock manufacturer had halted production of its ...

WLCSP Electroless Plating Market Projected to Hit $2.88 Billion By 2027 The rise in the impending need for circuit miniaturization & microelectronic devices and the cost-effectiveness of WLCSP ...

Maintaining internal compressive stress through 20 metal turnovers (MTO), the process provides consistent deposit properties over an extended operating life without the use of expensive ...

This study focuses on the preparation of Ni-plated polystyrene (PS) microspheres (diameter 3.7–4.5 μm). These Ni-plated PS microspheres have core–shell structures that were designed and prepared using ...