Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW cross-contamination and back-flow can be optimised with the Malema Interconnect ...
Airborne molecular contaminants (AMCs) pose a critical challenge in semiconductor manufacturing, where even trace levels of volatile chemicals and moisture can compromise device yield and reliability.
The heart of cleanroom technology is the High Efficiency Particulate Air (HEPA) and Ultra Low Particulate Air (ULPA) filters that trap particles as small as 0.3 microns with an efficiency of 99.99%.
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