Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Described as the smallest to date, the SD25 series SAW duplexer with integrated matching circuit in a chip scale package (CSP) employs a unique simulation technology that mounts the SAW element ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...