Fullerton, Calif. — Designed for the termination of high-speed applications, TT electronics BI Technologies Electronic Components Division's RoHS-compliant SCSI termination resistor network is aimed ...
A high-speed parallel bus, such as a double data rate (DDR) memory interface, requires a different approach because the speeds are lower but the number of signals involved is much larger. The design ...
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LG Innotek’s ‘Dream Factory’ revolutionizes chip substrate production with AI, robotics
LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...
Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...
With Moon Hyuk-soo, CEO of LG Innotek, promoted to president in the 2026 regular executive reshuffle, LG Innotek is still struggling to bear fruit in new businesses. Unlike Samsung Electro-Mechanics, ...
A BGA-packaged optocoupler from Fairchild Semiconductor offers the smallest form factor for a safety-rated device of this type. The FODB100 Microcoupler, a single-channel optocoupler with a transistor ...
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