Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

Canon cameras have been pretty spectacular in many ways. They offer great colors, a lot of details, and you get multiple ...

Using high-speed lasers, researchers have created "5D" data storage technology that could allow 500 TB of data to be written to a CD-sized glass disc, according to the Optica society. The technique ...

LOS ANGELES, May 19, 2020 /PRNewswire-PRWeb/ -- MedTech Breakthrough, an independent market intelligence organization that recognizes the top technology product companies in the global health and ...

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller ...

LAS VEGAS--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem ...